Product Texts
HiDura D1MG33J BK0816 is an organically heat stabilized, 33% glass filled PA612 designed for injection molding applications.
General
Additive
Heat Stabilizer
Features
Chemical Resistant, Hydrolysis Resistant, Organic Heat Stabilized, Thermal Stability
Appearance
Black
Forms
Pellets
Processing Method
Injection Molding
Physical
dry
cond.
Unit
Test Norm
Density
1.32
-
g/cm³
ISO 1183
Molding Shrinkage
ISO 294-4
Across Flow : 23°C, 2.00 mm
1.3
*
%
Flow : 23°C, 2.00 mm
0.4
*
%
Water Absorption
ISO 62
23°C, 24 hr
0.3
*
%
Equilibrium, 23°C, 50% RH
0.8
*
%
Mechanical
dry
cond.
Unit
Test Norm
Tensile Modulus (23°C)
1.42E6
1.15E6
psi
ISO 527-2
Tensile Stress (Break, 23°C)
23200
18400
psi
ISO 527-2
Tensile Strain (Break, 23°C)
3.5
5
%
ISO 527-2
Flexural Modulus (23°C)
1.36E6
1.13E6
psi
ISO 178
Flexural Strength (23°C)
34100
25700
psi
ISO 178
Impact
dry
cond.
Unit
Test Norm
Charpy Notched Impact Strength
ISO 179/1eA
+23°C
6.18
6.66
ftlb/in²
-30°C
4.76
4.76
ftlb/in²
-40°C
4.76
4.76
ftlb/in²
Charpy Unnotched Impact Strength
ISO 179/1eU
+23°C
40
36.6
ftlb/in²
-30°C
32.8
33.3
ftlb/in²
-40°C
32.8
30.9
ftlb/in²
Notched Izod Impact Strength
ISO 180/1A
+23°C
5.71
6.18
ftlb/in²
-30°C
4.76
4.66
ftlb/in²
-40°C
4.76
4.42
ftlb/in²
Thermal
dry
cond.
Unit
Test Norm
Heat Deflection Temperature
ISO 75-2/A
1.80 MPa, Unannealed
387
376
°F
0.45 MPa, Unannealed
412
410
°F
Melting Temperature
424
*
°F
ISO 11357-3
Electrical
dry
cond.
Unit
Test Norm
Dielectric Strength (1.00 mm)
787
762
kV/in
IEC 60243
Injection
Value
Unit
Drying Temperature
≤176
°F
Drying Time
≤4
h
Processing (Melt) Temperature
464 - 572
°F
Mold Temperature
140 - 248
°F